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Subsurface breakdown device reliability

Published in IEEE Transactions on Electron Devices • Mar 1, 1973
NobleIDNI5P11W79R51S32
Authors:
J. Mar

Abstract

New data from special bipolar junctions that breakdown below the Si-SiO 2 interface are described. The devices were broken down both in a dc and pulse fashion, and junction degradation in the form of increased reverse leakage and reduced minority carrier lifetime was investigated. No degradation was...

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