Alignment technology for backside integration
Published in Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE • Feb 2, 2011
Authors:,,
J. Bauer
P. Kulse
U. Haak
Abstract
This paper presents a backside-to-frontside alignment technique for the backside processing of Si wafers. Integrated MEMS components like BiCMOS-embedded RF-MEMS switches require accurate (1-2μm) alignment. We demonstrate an alignment technique providing overlay values of less than 500 nm by usin...
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