Process window modeling using compact models
Published in Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE • Dec 6, 2004
NobleIDNI9P38W58R35S19
Authors:,,
J. Andres Torres
Thomas Roessler
Yuri Granik
Abstract
Traditionally, there has been a clear separation between TCAD and full chip simulation tools. While TCAD is normally used during process development, it remains outside the realm of full chip corrections due to its long runtime requirements. One of the key components of a model-based OPC tool is fas...
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