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Electromigration induced resistance decrease in Sn conductors

Published in Journal of Applied Physics • Nov 7, 2003
NobleIDNI5P82W32R62S79
Authors:
J. R. Lloyd

Abstract

The resistance of thick film (2 μm) Sn conductors deposited onto Ni/Cr underlays was found to decrease several percent during electromigration stressing. The application of dc was necessary to initiate the resistance decrease. Equivalent ac current (rms values equal) did not produce the effect and e...

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