Testing multichip modules
Published in IEEE Spectrum • Mar 1, 1994
NobleIDNI7P02W00R87S53
Authors:
A. Flint
Abstract
Too complex to be tested as a chip and too packaged to be probed like a board, the multichip module presents a new set of challenges to the test engineer. The author describes how, until dedicated testers are developed, applying board-type tests using an IC tester will prove to be the most effective...
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