Decrease in Particles by Substituting Conductive Magnesium-Oxide Based Ceramics for Conventional Electrode Materials Used in Process Chamber of Plasma Etching
Published in IEEE Transactions on Semiconductor Manufacturing • Apr 7, 2021
Authors:,,
Yuji Kasashima
Takashi IKEDA
Tatsuo Tabaru
Abstract
The corrosion of ceramic chamber parts causes particles in plasma etching process, so that the production yield and the overall equipment effectiveness (OEE) at LSI mass production line are decreased. We have developed magnesium oxide (MgO)-based ceramics whose corrosion resistance in reactive plasm...
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