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Decrease in Particles by Substituting Conductive Magnesium-Oxide Based Ceramics for Conventional Electrode Materials Used in Process Chamber of Plasma Etching

Published in IEEE Transactions on Semiconductor Manufacturing • Apr 7, 2021
Authors:
Yuji Kasashima
,
Takashi IKEDA
,
Tatsuo Tabaru

Abstract

The corrosion of ceramic chamber parts causes particles in plasma etching process, so that the production yield and the overall equipment effectiveness (OEE) at LSI mass production line are decreased. We have developed magnesium oxide (MgO)-based ceramics whose corrosion resistance in reactive plasm...

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