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Published in Advanced Materials • Jan 1, 1992
NobleIDNI5P75W10R87S11
Authors:
David S. Ginley
,
Erich Engler
,
Peter Gölitz

Abstract

Insulating dielectric materials which possess a high thermal conductivity are required for the dissipation of heat from electrical and electronic equipment. As dissipation requirements increase with the miniaturization of circuitry, materials such as diamond, boron nitride, and silicon carbide are b...

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