Thin Array Polymer Packaging for RF Modules
Published in SMTA International • Sep 1, 2003
NobleIDNI7P73W54R93S03
Authors:
Leo M. Higgins
Abstract
ABSTRACT With the explosive growth of portable wireless electronic products, RF packaging has been ‘consumerized’. While RF packaging has always required careful design, resulting in compact components, widespread consumer sales have forced even greater attention on reduction in package size and mas...
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