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細幅Cu配線のストレスマイグレーション(低誘電率層間膜,配線材料及び一般)

Published in SIAM International Conference on Data Mining • Jan 30, 2006
NobleIDNI9P56W04R77S76
Authors:
隆宏 河野
,
貴志 鈴木
,
敏志 大塚
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