Simultaneous Multi-Layer Access
Published in ACM Transactions on Architecture and Code Optimization • Jan 6, 2016
Authors:,,
Donghyuk Lee
Saugata Ghose
Gennady Pekhimenko
Abstract
3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern systems by leveraging through silicon vias (TSVs) to deliver higher external memory channel bandwidth. Today’s systems, however, cannot fully utilize the higher bandwidth offered by TSVs, due to the limited inte...
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