Probe contact resistance variations during elevated temperature wafer test

Brož, Jan; Rincon, R.M.

doi:10.1109/test.1999.805761

Public

Probe contact resistance variations during elevated temperature wafer test

Shared by NobleBlocks on Jan 20, 2003 • 12:00 AM UTC

Authors:

Jan Brož

R.M. Rincon

Abstract

Localized electrical contact phenomena during wafer test can significantly affect contact resistance magnitude and stability of tungsten (W), tungsten-rhenium (WRe), beryllium-copper (BeCu), Pd-alloy (Paliney-7), and metallic-alloy (NewTek-Probe) probes. Typically, increased and unstable contact res...

Subject

Tungsten

Contact resistance

Materials science

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