添加微量鈀對錫銀銅鈀/無電鍍鎳金板的微結構、界面反應與衝擊可靠度之影響

Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) surface finish has been developed to overcome the “black pad” issue of Electroless Nickel/Immersion Gold (ENIG) recently. After reflow, the electroless Pd layer of ENEPIG would dissolve into solder matrix, which might reduce the growth... View More