錫銀銅銲料與無電鍍鎳(磷)/鈀/金底層金屬之微觀結構、可靠度測試及結構方向性

Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is widely used as surface finish for metal bond pad in the electronic packaging industries. The widespread adoption of ENEPIG is attributed to its many advantages, and the most important one, it resolves the so-called “black pad” reliability pro... View More