錫基無鉛銲料與鎳、銅、及新穎銅鋅合金底層金屬接點之相關界面反應、微結構變化及衝擊可靠度

In the flip-chip (FC) solder joint, solder alloys usually connect with Ni and Cu based under bump metallurgies (UBMs) at chip-side and substrate-side, respectively. The material selection for solder alloys and UBM material is a critical issue to affect the microstructure, phase formation, and the re... View More